DOW EA-4100 300ml White Silicone Adhesive Sealant for Electronics and General Assembly Room Temperature Cure Moisture Resistant Flexible Durable Bond

DOW EA-4100 Silicone Adhesive Sealant 300 ml Cartridge Product Overview DOW EA-4100 is a one-part, white, non-sag silicone adhesive supplied as a ready-to-use paste. It cures at room temperature under ambient humidity, forming a durable, flexible rubber bond without the need for heat curing. Designed for electronic and general industrial assembly, it provides strong adhesion and long-term reliability. Applications Ideal for bonding or sealing electronic housings, heat sinks, and substrates, especially with needle-dispense equipment. Suitable for gasketing or potting where a low-slump, stable bead is required. Adheres without primer to metals, ceramics, glass, and many plastics used in consumer and industrial equipment. Performs reliably across a wide temperature range of –45 °C to +200 °C for long-term service. Key Benefits One-component, ready-to-use formulation – no mixing required. Cures from the surface inward in 30–80 % relative humidity. Fast handling time – tack-free in about 9 minutes at 25 °C. Low slump (≈ 0.4 cm), maintaining bead shape on vertical joints. High tensile strength (335 psi / 2.3 MPa) with 250 % elongation, ensuring flexibility and vibration resistance. Shore A 45 hardness offers a balance between mechanical support and elasticity. Excellent resistance to moisture, weathering, and solvent splash (not suitable for continuous solvent immersion). Shelf life of 12 months unopened when stored below 25 °C. Typical Physical Properties Color: White paste Specific Gravity: 1.42 Extrusion Rate: 260 g/min (3 mm orifice @ 90 psi) Flow / Slump: ≤ 0.4 cm, excellent vertical hold Tack-Free Time: 9 min @ 25 °C / 50 % RH Tensile Strength: 335 psi (2.3 MPa) Elongation: 250 % Hardness (Shore A): 45 Volume Resistivity: > 1 × 10¹⁴ Ω·cm (typical for cured silicone) Summary DOW EA-4100 provides strong, flexible bonding and reliable sealing performance for electronics and general assembly work. Its room-temperature, moisture-cure design allows easy application, fast handling, and dependable adhesion to various substrates, making it an excellent choice for demanding industrial environments.

• A non-slumping white silicone adhesive that cures at room temperature under ambient humidity, eliminating the need for ovens. It forms a tough, flexible bond suitable for both electronic and general assembly applications.
• Temperature Range: –45 °C to +200 °C (long-term service).
• Applications: Ideal for bonding or sealing housings, heat sinks, and substrates in electronic assemblies where precision needle-dispensing is required.
• Adhesion: Provides reliable, primerless bonding to reactive metals, ceramics, glass, and a wide range of plastics used in consumer and industrial equipment.